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 FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
November 2005
FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
Features
AC input response (FOD814 only) Applicable to Pb-free IR reflow soldering Compact 4-pin package Current transfer ratio in selected groups:
Applications
FOD814 Series AC line monitor Unknown polarity DC sensor Telephone line interface FOD617 and FOD817 Series
Power supply regulators Digital logic inputs Microprocessor inputs

FOD617A: 40-80% FOD817: 50-600% FOD617B: 63-125% FOD817A:80-160% FOD617C: 100-200% FOD817B: 130-260% FOD617D: 160-320% FOD817C:200-400% FOD814: 20-300% FOD817D:300-600% FOD814A: 50-150% C-UL, UL and VDE approved High input-output isolation voltage of 5000Vrms Higher operating temperatures (versus FODXXX counterparts) Minimum BVCEO of 70V guaranteed
Description
The FOD814 consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a silicon phototransistor output in a 4-pin dual in-line package. The FOD617/817 Series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 4-pin dual in-line package.
Functional Block Diagram
ANODE, CATHODE 1 4 COLLECTOR
ANODE 1
4 COLLECTOR
CATHODE, ANODE 2
3 EMITTER
CATHODE 2
3 EMITTER
4
FOD814
FOD617/817
1
(c)2005 Fairchild Semiconductor Corporation
1
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
Absolute Maximum Ratings (TA = 25C Unless otherwise specified.)
Value Parameter
TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Total Power Dissipation EMITTER Continuous Forward Current Reverse Voltage Power Dissipation Derate above 100C DETECTOR Collector-Emitter Voltage Emitter-Collector Voltage Continuous Collector Current Collector Power Dissipation Derate above 90C VCEO VECO IC PC 6 50 150 2.9 70 6 (FOD817) 7 (FOD617) V V mA mW mW/C IF VR PD 50 -- 70 1.7 50 6 mW mW/C mA TSTG TOPR TSOL PTOT -55 to +150 -55 to +105 200 -55 to +110 260 for 10 sec C C C mW
Units
Symbol
FOD814
FOD617/817
2 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
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FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
Electrical/Characteristics (TA = 25C Unless otherwise specified.)
Individual Component Characteristics Parameter
EMITTER Forward Voltage FOD814 FOD617 FOD817 FOD617 FOD817 FOD814 FOD617 FOD817 FOD814 FOD617C/ D FOD617A/ B FOD817 FOD814 FOD617 FOD817 FOD814 FOD617 FOD817 (IF = 20 mA) (IF = 60 mA) (IF = 20 mA) (VR = 6.0 V) (VR = 4.0 V) (V = 0, f = 1 kHz) (V = 0, f = 1 kHz) (V = 0, f = 1 kHz) (VCE = 20 V, IF = 0) (VCE = 10 V, IF = 0) (VCE = 10 V, IF = 0) (VCE = 20 V, IF = 0) VF -- -- -- -- -- -- -- -- -- -- -- -- 1.2 1.35 1.2 0.001 -- 50 30 30 -- 1 1 -- 1.4 1.65 1.4 10 10 250 250 250 100 100 50 100 V
Device
Test Conditions
Symbol
Min
Typ*
Max
Unit
Reverse Leakage Current Terminal Capacitance
IR Ct
A pF
DETECTOR Collector Dark Current ICEO nA
Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage
(IC = 0.1 mA, IF = 0) (IC = 100 A, IF = 0) (IC = 0.1 mA, IF = 0) (IE = 10 A, IF = 0) (IE = 10 A, IF = 0) (IE = 10 A, IF = 0)
BVCEO
70 70 70 6 7 6
-- -- -- -- -- --
-- -- -- -- -- --
V
BVECO
V
Transfer Characteristics (TA = 25C Unless otherwise specified.)
DC Characteristic Current Transfer Ratio Device FOD814 FOD814A FOD617A FOD617B FOD617C FOD617D FOD617A FOD617B FOD617C FOD617D FOD817 FOD817A FOD817B FOD817C FOD817D Collector-Emitter Saturation Voltage FOD814 FOD617 FOD817 Cut-Off Frequency FOD814 IF = 20 mA, IC = 1 mA IF = 10 mA, IC = 2.5 mA IF = 20 mA, IC = 1 mA VCE = 5 V, IC = 2 mA, RL = 100 , -3dB fC VCE (sat) IF = 5 mA, VCE = 5 V1 IF = 1 mA, VCE = 5 V1 IF = 10 mA, VCE = 5 V1 Test Conditions IF = 1 mA, VCE = 5 V1 Symbol CTR Min 20 50 40 63 100 160 13 22 34 56 50 80 130 200 300 -- -- -- 15 -- -- -- -- -- 0.1 -- 0.1 80 600 160 260 400 600 0.2 0.4 0.2 -- KHz V Typ* -- Max 300 150 80 125 200 320 Unit %
*Typical values at TA = 25C
3 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
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FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
Transfer Characteristics (continued) (TA = 25C Unless otherwise specified.) AC Characteristic
Response Time (Rise)
Device
FOD814 FOD617 FOD817 FOD814 FOD617 FOD817
Test Conditions
VCE = 2 V, IC = 2 mA, RL = 100 2
Symbol
tr
Min
--
Typ*
4
Max
18
Unit
s
Response Time (Fall)
tf
--
3
18
s
Isolation Characteristics Characteristic
Input-Output Isolation Voltage3
Device
FOD814 FOD617 FOD817 FOD814 FOD617 FOD817
Test Conditions
f = 60Hz, t = 1 min
Symbol
VISO
Min
5000
Typ*
Max
Units
Vac(rms)
Isolation Resistance
VI-O = 500 VDC
RISO
5x1010
1x1011
--
Isolation Capacitance
FOD814 FOD617 FOD817
VI-O = 0, f = 1 MHz
CISO
0.6
1.0
pf
*Typical values at TA = 25C
Notes 1. Current Transfer Ratio (CTR) = IC/IF x 100%. 2. For test circuit setup and waveforms, refer to page 4. 3. For this test, Pins 1 and 2 are common, and Pins 3 and 4 are common.
4 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
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FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
Typical Electrical/Optical Characteristic Curves (TA = 25C Unless otherwise specified.)
COLLECTOR POWER DISSIPATION PC (mW) COLLECTOR POWER DISSIPATION PC (mW) Fig. 1 Collector Power Dissipation vs. Ambient Temperature (FOD814) 200 Fig. 2 Collector Power Dissipation vs. Ambient Temperature (FOD617/817) 200
150
150
100
100
50
50
0 -55 -40 -20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE TA (C)
0 -55 -40 -20
0
20
40
60
80 100 120
AMBIENT TEMPERATURE TA (C)
6 COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) 5 4 3 2 1 0
Fig. 3 Collector-Emitter Saturation Voltage vs. Forward Current
Fig. 4 Forward Current vs. Forward Voltage (FOD814) 100 FORWARD CURRENT IF (mA)
TA = 105 C 75oC 50 C
o o
Ic = 0.5m A 1m A 3m A 5m A 7m A
Ta = 25C
10
25oC 0oC
1
-30 C -55 C
o
o
0
2.5 5.0 7.5 10.0 12.5 FORWARD CURRENT IF (mA)
15.0
0.1 0.5
1.0
1.5
2.0
FORWARD VOLTAGE VF (V)
CURRENT TRANSFER RATIO CTR ( %)
Fig. 5 Forward Current vs. Forward Voltage (FOD617/817) 100 FORWARD CURRENT IF (mA)
TA = 110 C 75oC 50 C
o o
Fig. 6 Current Transfer Ratio vs. Forward Current
140 120 100 80 60 40 20
V = 5V Ta= 25C FOD617/817
10
25oC 0oC
1
-30 C -55 C
o
o
FOD814
0.1 0.5
1.0
1.5
2.0
0 0. 1 0.2
FORWARD VOLTAGE VF (V)
0.5 1 2 5 10 20 50 100 FORWARD CURRENT IF (mA)
5 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
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FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
Typical Electrical/Optical Characteristic Curves (TA = 25C Unless otherwise specified.)
Fig. 7 Collector Current vs. Collector-Emitter Voltage (FOD814)
50
COLLECTOR CURRENT IC (mA) COLLECTOR CURRENT IC (mA)
Fig. 8 Collector Current vs. Collector-Emitter Voltage (FOD617/817)
30
I IF = 30mA Ta = 25C 20mA Pc(MAX.)
Ta= 25C I F = 30m A 40 20 m A
25 20 15
30
Pc (M AX.)
20
10m A 5m A
10mA
10
5m A
10 1m A 0 0 10 20 30 40 50 60 70 80 90 100
COLLECTOR-EMITTER VOLTAGE VCE (V)
5 0 0 10 20 30 40 50 60 70 80 90
COLLECTOR-EMITTER VOLTAGE VCE (V)
Fig. 9 Relative Current Transfer Ratio vs. Ambient Temperature
RELATIVE CURRENT TRANSFER RATIO (%)
FOD814 140 120 100 80 60 40 20 0 -60 -40 -20 0 20 40 60 80 100 120 FOD617/817
IF = 5mA VCE = 5V
IF = 1 mA VCE = 5V
Fig. 10 Collector-Emitter Saturation Voltage vs. Ambient Temperature
COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V)
0.12
I = 20mA
F
160
0.10 0.08 0.06 0.04 0.02
IC = 1mA
AMBIENT TEMPERATURE TA (C)
0.00 -60 -40 -20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE TA (C)
Fig. 11 LED Power Dissipation vs. Ambient Temperature (FOD814)
LED POWER DISSIPATION PLED (mW) LED POWER DISSIPATION PLED (mW)
100
Fig. 12 LED Power Dissipation vs. Ambient Temperature (FOD617/817)
100
80
80
60
60
40
40
20
20
0 -55 -40 -20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE TA (C)
0 -55 -40 -20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE TA (C)
6 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
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FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
Typical Electrical/Optical Characteristic Curves (TA = 25C Unless otherwise specified.)
Fig. 13 Response Time vs. Load Resistance
100 50 VCE = 2V Ic= 2mA Ta = 25C
Fig. 14 Frequency Response
VCE = 2V Ic = 2mA Ta = 25C
RESPONSE TIME (s)
20 10 5 2 1 0.5 0.2 0.1
tf td ts
VOLTAGE GAIN AV (dB)
tr
0
RL=10k -10
1k
100
0.1 0.2 0.5 1 2 5 LOAD RESISTANCE RL (k)
10
-20 0.2
0.5 15 2 10 100 FREQUENCY f (kHz)
1000
COLLECTOR DARK CURRENT ICEO (nA)
Fig. 15 Collector Dark Current vs. Ambient Temperature
VCE = 20V
10000 1000 100 10 1 0.1 0.01 -60 -40 -20
0
20 40 60 80 100 120
AMBIENT TEMPERATURE TA (C)
Test Circuit for Response Time
Input Vcc Output RL Output
Test Circuit for Frequency Response
Vcc RD RL Output
Input
RD
10% 90%
td tr
ts tf
7 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
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FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
Package Dimensions (Through Hole)
0.312 (7.92) 0.288 (7.32)
Package Dimensions (Surface Mount)
SEATING PLANE
0.157 (4.00) 0.118 (3.00)
SEATING PLANE
0.200 (5.10) 0.161 (4.10)
0.276 (7.00) 0.236 (6.00)
0.200 (5.10) 0.161 (4.10)
0.312 (7.92) 0.288 (7.32) 0.276 (7.00) 0.236 (6.00)
0.157 (4.00) 0.118 (3.00) 0.010 (0.26)
0.130 (3.30) 0.091 (2.30)
0.020 (0.51) TYP
0.051 (1.30) 0.043 (1.10)
0.024 (0.60) 0.004 (0.10)
0.049 (1.25) 0.030 (0.76) 0.412 (10.46) 0.388 (9.86)
0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40)
0.010 (0.26) 0.300 (7.62) typ
0.110 (2.79) 0.090 (2.29) Lead Coplanarity 0.004 (0.10) MAX
0.110 (2.79) 0.090 (2.29)
Package Dimensions (0.4" Lead Spacing)
0.200 (5.10) 0.161 (4.10) 0.312 (7.92) 0.288 (7.32) 0.157 (4.00) 0.118 (3.00) 0.276 (7.00) 0.236 (6.00)
Footprint Dimensions (Surface Mount)
1.5 1.3
SEATING PLANE
0.130 (3.30) 0.091 (2.30) 0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40) 0.110 (2.79) 0.090 (2.29) 0.42 (10.66) 0.38 (9.66) 0.110 (2.80) 0.011 (1.80)
0.291 (7.40) 0.252 (6.40)
9
0.010 (0.26)
2.54
NOTE All dimensions are in inches (millimeters)
8 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
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FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
Ordering Information
Option
S SD W 300 300W 3S 3SD
Part Number Example
FOD814S FOD814SD FOD814W FOD814300 FOD814300W FOD8143S FOD8143SD
Description
Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE Approved VDE Approved, 0.4" Lead Spacing VDE Approved, Surface Mount VDE Approved, Surface Mount, Tape & Reel
Marking Information
4
5
V X ZZ Y
3
6
814
1
2
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code Two digit work week ranging from `01' to `53' Assembly package code
9 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
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FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
Carrier Tape Specifications
O1.550.05 P2 P0 1.750.1
F W B0 A0 P1 0.30.05
K0
NOTE
All dimensions are in millimeters
Description
Tape wide Pitch of sprocket holes Distance of compartment Distance of compartment to compartment Compartment
Symbol
W P0 F P2 P1 A0 B0 K0
Dimensions in mm (inches)
16 0.3 (.63) 4 0.1 (.15) 7.5 0.1 (.295) 2 0.1 (.079) 12 0.1 (.472) 10.45 0.1 (.411) 5.30 0.1 (.209) 4.25 0.1 (.167)
10 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
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FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
Lead Free recommended IR Reflow condition
Tp
Temperature (C)
Tsmax
Ramp-down
Tsmin
25C ts (Preheat) Time (sec)
Profile Feature
Preheat condition (Tsmin-Tsmax / ts) Melt soldering zone Peak temperature (Tp) Ramp-down rate
Soldering zon
Pb-Sn solder assembly
100C ~ 150C 60 ~ 120 sec 183C 60 ~ 120 sec 240 +0/-5C 6C/sec max.
Lead Free assembly
150C ~ 200C 60 ~120 sec 217C 30 ~ 90 sec 260 +0/-5C 6C/sec max.
Recommended Wave Soldering condition
Profile Feature
Peak temperature (Tp)
For all solder assembly
Max 260C for 10 sec
11 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
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FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM FAST(R) ActiveArrayTM FASTrTM BottomlessTM FPSTM Build it NowTM FRFETTM CoolFETTM GlobalOptoisolatorTM CROSSVOLTTM GTOTM DOMETM HiSeCTM EcoSPARKTM I2CTM 2 E CMOSTM i-LoTM EnSignaTM ImpliedDisconnectTM FACTTM IntelliMAXTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM
DISCLAIMER
ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM
PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3
SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM WireTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILDiS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I17
12 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
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